Effect of High-Density Plasma Process Parameters on Carrier Transport Properties in p-to-n Type Converted HG0.7CD0.3TE Layer

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Abstract

Exposure of p-type HgCdTe material to Ar/H-2-based plasma is known to result in p-to-n conductivity-type conversion. While this phenomenon is generally undesirable when aiming to perform physical etching for device delineation and electrical isolation, it can be used in a novel process for formation of n-on-p junctions. The properties of this n-type converted material are dependent on the condition of the plasma to which it is exposed. This paper investigates the effect of varying the plasma process parameters in an inductively coupled plasma reactive ion etching (ICPRIE) tool on the carrier transport properties of the p-to-n type converted material. Quantitative mobility spectrum analysis of variable-field Hall and resistivity data has been used to extract the carrier transport properties. In the parameter space investigated, the n-type converted layer carrier transport properties and depth have been found to be most sensitive to the plasma process pressure and temperature. The levels of both RIE and ICP power have also been found to have a significant influence.
Original languageEnglish
Pages (from-to)913-918
JournalJournal of Electronic Materials
Volume36
Issue number8
DOIs
Publication statusPublished - 2007

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